:::SEC::: X-ray Inspection System and Scanning Electron Microscope

Industrial X-ray inspection system, X-eye Series, cover all non-destructive X-ray inspection application. All X-eye series features outstanding configuration flexibility with various software tools, unparallel operator-friendly ergonomic design.

X-eye Series:

SF160 SeriesSemiconductor, PCB/SMD 3D Analysis.

7000 SeriesCastings, Large Product NDT.

5000 SeriesPCB/SMD Inspection.

(2011 New Product:X-eye 5000BTS)

3000ASmall Component Inspection.

X-ray Inspection Application

PCB (Printed Circuit Board) / SMD (Surface Mounted Device)

- Multi-layer Board Pattern / Via-hole

- BGA/CSP open, cold solder, crack

Semiconductor Packaging and High-technology Application

- Gold/Copper Wire inside Packaging.

- Bump/Pattern Delamination, Chip Crack, TSV Filling.

Electronics (LED, Connector, Capacitor, Camera Module)

- Pattern Open/short, Hidden Contamination.

- Component Attachment.

Automotive/Aerospace Components, Die-Castings (Large Product)

- Casting Porosity, Shrinkage, Cracks.

- Reverse Engineering.

Mini-SEM 4000M

Imagine a Higher State of Resolution

Scanning Electron Microscope

SEC provides premier electron microscope for nanotechnology. Nano-eye series covers affordable table-top electron microscope for entry level as well as conventional scanning electron microscope for experienced level.

Nano-eye Series:

Mini-SEM 3000MMax. 30,000x, 5kV~30kV Accelerating Voltage.

Mini-SEM 4000MMax. 60,000x, Tilt and Rotation strokes added

SNE-5000MMax. 300,000x Full Motorized Stages

EDS SystemElemental Analysis Option.

SEM Application